Requisition ID: R10176126Category: Engineering Location: Linthicum, Maryland, United States of America Clearance Type: SCI Telecommute: No- Teleworking not available for this position Shift: 2nd Shift (United States of America) Travel Required: Yes, 10 of the Time Relocation Assistance: Relocation a
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Principal / Senior Principal Process Integration Engineer

Northrop Grumman • 
Linthicum Heights, Maryland, United States
Position Type: Permanent
Job Description:
Requisition ID: R10176126
  • Category: Engineering
  • Location: Linthicum, Maryland, United States of America
  • Clearance Type: SCI
  • Telecommute: No- Teleworking not available for this position
  • Shift: 2nd Shift (United States of America)
  • Travel Required: Yes, 10 of the Time
  • Relocation Assistance: Relocation assistance may be available
  • Positions Available: 1
At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact peoples lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nations history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, theyre making history.

The Northrop Grumman Microelectronics Center (NGMC) of Northrop Grumman Mission Systems is seeking an exceptionally talented, motivated, and creative Principal Semiconductor Process Integration Engineer or Senior Principal Semiconductor Process Integration Engineer (Off-Centered 2nd Shift) position located at our Linthicum, MD facility.  Advanced Technology Lab (ATL) is located just outside of Baltimore, MD - where we design, manufacture, and test semiconductor products for internal and commercial production as well as emerging programs. We have over 21,000 square feet of Class 100 wafer fabrication cleanroom that supports variants of Si; SiGe; GaAs; SiC.

At Northrop Grumman’s Advanced Technology Lab – VARIETY describes the work that our process integration team enjoys. The process integration team at ATL has the chance to work on both production and development programs, as well as troubleshooting and process improvements. Many people on our process integration team work on more than one product/program at once, and have exposure to other products as well. The semiconductor process integration group is also an integral part of the foundry process, interfacing with multiple other foundry groups on a daily basis.

Roles and Responsibilities:

The Principal Semiconductor Process Integration Engineer or Senior Principal Semiconductor Process Integration Engineer (Off-Centered 2nd Shift) will be focusing on Superconducting Electronics with opportunities to connect with multiple advanced technologies. The Process Integration Engineer must have an understanding of basic semiconductor processing, especially in Back End of Line (BEOL) process integration with knowledge in yield improvement and defect reduction. This candidate must have an aptitude for hands-on laboratory and experimental work. Excellent verbal and written communication skills are required. The successful candidate may also support program execution for programs within the Micro Systems Technologies portfolio.

Join us for the chance to work with an amazing, experienced, and talented team. We are expanding with new work on many development and production programs.

This requisition may be filled as either Principal Semiconductor Process Integration Engineer or Senior Principal Semiconductor Process Integration Engineer

Basic Qualifications for Principal Semiconductor Process Integration Engineer:

  • Bachelor’s Degree in Engineering, Microelectronics, Material Science, Chemistry, Physics or closely related technical major with 5+ years of relevant experience; Master’s Degree in Engineering, Microelectronics, Material Science, Chemistry, Physics or closely related technical major with 3+ years of relevant experience; PhD in Engineering, Microelectronics, Material Science, Chemistry, Physics or closely related technical major with 1+ years of relevant experience.

  • Must have an understanding of basic semiconductor processing, especially in Back End of Line (BEOL) process integration

  • Must have an aptitude for hands-on laboratory and experimental work.

  • Must work Off-Centered 2nd Shift – Wednesday - Saturday 2:00pm-12:30am

  • Experience interfacing with multiple shifts in a 24/7 environment

  • U.S. Citizenship required.

  • The ability to obtain and maintain a DoD Top Secret w/SCI clearance is required.

Basic Qualifications for Senior Principal Semiconductor Process Integration Engineer:

  • Bachelor’s Degree in Engineering, Microelectronics, Material Science, Chemistry, Physics or closely related technical major with 8+ years of relevant experience; Master’s Degree in Engineering, Microelectronics, Material Science, Chemistry, Physics or closely related technical major with 6+ years of relevant experience; PhD in Engineering, Microelectronics, Material Science, Chemistry, Physics or closely related technical major with 3+ years of relevant experience.

  • Must have an understanding of basic semiconductor processing, especially in Back End of Line (BEOL) process integration

  • Must have an aptitude for hands-on laboratory and experimental work.

  • Must work Off-Centered 2nd Shift – Wednesday - Saturday 2:00pm - 12:30am

  • Experience interfacing with multiple shifts in a 24/7 environment

  • U.S. Citizenship required.

  • The ability to obtain and maintain a DoD Top Secret w/SCI clearance is required.

Preferred Qualifications:

  • TS/ SCI clearance

  • Semiconductor processing, analog and microwave electronic circuits experience

  • FEOL, BEOL, Far-BEOL semiconductor fabrication experience

  • Superconducting electronics experience

  • DC test analysis, PCM analysis, and production engineering experience

  • Knowledge of yield improvement and defect reduction utilizing automated defect inspection tools and software.

  • Experience with DOEs, JMP, and statistical analysis

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Salary Range: $102,400 - $153,600
Salary Range 2: $127,000 - $190,600
The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidates experience, education, skills and current spanet conditions.
Employees may be eligible for a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.
The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates.

Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit. U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.

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